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for Electronics

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Additively Manufactured Electronics

High fidelity active electronic and electromechanical subassemblies are integral enablers of autonomous intelligent drones, cars, satellites, smartphones, and in vivo medical devices. They necessitate iterative development, IP safety, fast time-to-market and device performance gains, thereby mandating AME for in-house, rapid prototyping and production.

Nano Dimension machines serve cross-industry needs by depositing proprietary consumable conductive and dielectric materials simultaneously, while concurrently integrating in-situ capacitors, antennas, coils, and transformers and electromechanical components, to function at unprecedented performance. Those turn-key systems bridge the gap between PCB and semiconductor Integrated Circuits.

A revolution at the click of a button: From CAD to a functional high- performance AME device in hours, solely at the cost of the consumable materials.

DragonFly IV

Build, Test, and Iterate Electronics in a Single Day!

A multi-material, multi-layer 3D printer that generates entire circuits in one step — including substrate, conductive traces, and passive components.

Design Flexibility Beyond Traditional Boundaries

A completely new way to build electronics.

Freedom in Three Dimensions

Layouts can now make connections in any 3D direction.

Novel Form Factors

FLIGHT software allows for new shapes in electro-mechanical CAD.

FLIGHT Plan

3D Data Preparation

Turn your PCB into any 3D geometry.

FLIGHT Check

Design Verification

Verify your 3D design manufacturability.